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 CHM1290
20-30GHz SUB-HARMONICALLY PUMPED MIXER
GaAs Monolithic Microwave IC Description
The CHM1290 is a MFC which integrates a self biased LO buffer amplifier and a subharmonically diodes mixer for 2LO suppression It is usable both for up-conversion and downconversion. It is designed for a wide range of applications, typically commercial communication systems for broadband local access (LMDS). The backside of the chip is both RF and DC grounds. This helps simplify the assembly process. The circuit is manufactured with a PM-HEMT process, 0.25m gate length, capacities over via holes, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form.
Main Features * * * * * * *
Broadband performance : 20-30GHz 10dB conversion Loss 29dB 2LO to RF isolation -4dBm LO input power -3dBm input power 1 dB compression Low DC power consumption, 33mA@4.0V Chip size : 0.86 X 1.28 X 0.10 mm
Main Characteristics
Tamb. = 25C Parameter Min Typ Max Unit
FRF FLO FIF Lc
RF frequency range LO frequency range IF frequency range Conversion Loss
20 10 DC 10
30 15 6 12
GHz GHz GHz dB
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHM12902045 - 14-Feb.-02 1/6 Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
20-30GHz SHP Mixer
CHM1290
Electrical Characteristics for Broadband Operation
Tamb = +25C, Vd = 4.0V Id=33mA Symbol
FRF FLO FIF Lc PLO
Parameter
RF frequency range LO frequency range IF frequency range Conversion Loss LO Input power
Min
20 10 DC
Typ
Max
30 15 6
Unit
GHz GHz GHz dB dBm dBm
10 -4 30 -3 0 2.0:1 2.0:1 2.0:1 1.1 33
12 8
2xLO Leak 2xLO Leakage (for PLO=-4dBm) IP1dB LO Match RF Match IF Match Sz Id Input power at 1dB gain compression LO Matching RF Matching IF Matching Chip size Bias current
3
dBm
mm mA
Absolute Maximum Ratings
Tamb. = 25C (1) Symbol
Vd Id Pin Ta Tstg Drain bias voltage Drain bias current Maximum peak input power overdrive (2) Operating temperature range Storage temperature range
Parameter
Values
5.0 50 TBD -40 to +85 -55 to +155
Unit
V mA dBm C C
(1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s.
Ref. : DSCHM12902045 - 14-Feb.-02
2/6
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
20-30GHz SHP Mixer
CHM1290
CHM1290 : Conversion Loss & Leakages
Vds = 4.0V, Ids = 33mA ; LO Power = -4dBm / IF Frequency = 1.0GHz 0.0 -2.5 -5.0 Conversion Loss ( dB ) -7.5 -10.0 -12.5 -15.0 -17.5 -20.0 -22.5 -25.0 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 5
Lc (2xLO+IF)
Lc (2xLO-IF)
P LO @ RF
P 2*LO @ RF
0 -5 -10 -15 -20 -25 -30 -35 -40 -45 16.0 Leakage @ LO & 2xLO ( dBm )
LO Frequency ( GHz )
CHM2190 : Conversion LOSS
Vds = 4.0V, Ids = 33mA LO Power = -4dBm / IF Frequency = 2.0GHz
-5 -6 -7 -8 Conversion Gain ( dB ) -9 -10 -11 -12 -13 -14 -15 10.0 10.5 11.0 11.5 12.0 LO Frequency ( GHz ) 12.5 13.0 13.5 14.0
RF Freq. = 22GHz
RF Freq. = 30GHz
Ref. : DSCHM12902045 - 14-Feb.-02
3/6
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
20-30GHz SHP Mixer
CHM1290
CHM1290 : Conversion Loss & Leakages
Vds = 4.0V, Ids = 33mA ; LO Power = 0dBm / IF Frequency = 1.0GHz 0.0 -2.5 -5.0 Conversion Loss ( dB ) -7.5 -10.0 -12.5 -15.0 -17.5 -20.0 -22.5 -25.0 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 Lc (2xLO+IF) Lc (2xLO-IF) P LO @ RF P 2*LO @ RF 5 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 16.0 Leakage @ LO & 2xLO ( dBm )
LO Frequency ( GHz )
Ref. : DSCHM12902045 - 14-Feb.-02
4/6
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
20-30GHz SHP Mixer
Chip Assembly and Mechanical Data
CHM1290
RF Input/Output bonding wires as short as possible Vd Voltage
10nF
120pF
IF Input/Output DC coupled to diodes
LO Input/Output bonding wires as short as possible
Note : Supply feed should be capacitively bypassed. 25m diameter gold wire is recommended
Bonding pad positions
810 +/- 35 35
1280 +/- 35
860
760
260
140
35
( Chip thickness : 100m. All dimensions are in micrometers )
Ref. : DSCHM12902045 - 14-Feb.-02 5/6 Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
20-30GHz SHP Mixer
CHM1290
Ordering Information
Chip form : CHM1290-99F/00
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.
Ref. : DSCHM12902045 - 14-Feb.-02
6/6
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09


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